IT equipment is generating more heat than ever and the cost to cool that equipment is increasing. Based on measurements at multiple data centers, 50-80 percent of valuable conditioned air is not reaching the air intake of IT equipment due to unsealed floor openings—some as small and seemingly innocuous as 4 x 6 inches. This lost air, known as bypass airflow, contributes to IT equipment hotspots, cooling unit inefficiencies, and increasing infrastructure costs. KoldLok Grommets are specifically designed to reduce bypass airflow to improve data center cooling.

The KoldLok Mini Raised Floor Grommet is the latest patent-pending thermal management solution from Upsite Technologies. Designed with virtually all of the original KoldLok product family features, the KoldLok Mini Grommet is also fire-rated and positioned at a lower price point. With the KoldLok Mini Grommet, optimize the effectiveness of existing cooling equipment and manage the increasing heat loads to ensure site uptime and reliability. The KoldLok Mini Grommet is offered with the static-dissipation feature (Item No. 10052) or without the static-dissipation feature (Item No. 10077).

Overview

KoldLok Mini Raised Floor Grommets

Seal small, 4 x 6 inch (100 x 150 mm) cable openings with the KoldLok® Mini Raised Floor Grommet, the latest patent-pending thermal management solution from Upsite Technologies. Designed with virtually all of the original KoldLok engineering, the KoldLok Mini Grommet is also fire-rated and positioned at a lower price point. With the KoldLok Mini Grommet, optimize the effectiveness of existing cooling equipment and manage increasing heat loads to ensure site uptime and reliability. The KoldLok Mini Grommet is offered with the static-dissipation feature (Item No. 10052) or without (Item No. 10077).

Applications
Designed to seal small cable openings in the raised floor of new or existing computer rooms.
Based on measurements at multiple data centers, 50-80 percent of valuable conditioned air is not reaching the air intake of IT equipment due to unsealed floor openings—some as small as 4 x 6 inches (100 x 150 mm). This lost air, known as bypass airflow, contributes to IT equipment hotspots, cooling unit inefficiencies, and increasing infrastructure costs. KoldLok products are specifically designed to reduce bypass airflow to improve data center cooling.

Features and Benefits

• Made with fire-rated resin and filaments that meet UL94 V0 standards
• Smaller size offers flexibility for data centers that have multiple cable opening sizes
• Meets smaller cable opening standards specified in new data center builds
• Cost-effective method of separating data cabling from power cabling
• KoldLok engineering at a lower price point
• The static-dissipation feature integrates with the raised floor static dissipation system, providing 1 GigaOhm of resistance
• Contains no loose or partially fastened parts that can become separated or fall through the raised floor
• Impact-resistant and durable
• Satisfies NFPA 75 Section 5-4.4 requirement by self-dressing the raw metal edges of raised-floor tile cable openings
• KoldLok products are compliant with Directive 2002/95/EC of the European Parliament and the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

• Increasing existing cooling infrastructure capacity
• Reducing or deferring capital expenses needed to purchase additional cooling units
• Increasing static pressure and airflow through perforated floor tiles and grates
• Improving IT equipment reliability
• Responds to the demand for an innovative, easy-to-implement solution that helps data centers execute their green and energy efficiency initiatives